Principal Advanced Packaging Engineer
Astera Labs, San Jose, California, United States
$205,000 – $260,000 / year
about the median for principal mechanical roles
Principal levelMechanical
You will lead R&D for next-generation packaging of optical chips including 2.5D and 3D integration, setting technical direction for NPO and CPO products. You need senior expertise in advanced packaging processes, optical device integration, and material qualification.
Posted September 14, 2026 (3w ago)